Dicing Tapes Market - Global industry analysis, Size, Share, Growth, Trends and Forecast 2018 - 2028


Transparency Market Research

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Dicing tapes market: overview

Manufacturing semiconductors requires automation efficiency and productivity and one of the production steps in this process is wafer dicing. Dicing tapes are basically designed to hold the semiconductor wafer during dicing process. This process separates the dies and also keeps the chips within tight tolerances regarding dimensions, edges, orientation and position. Dicing tapes are made of materials such as PVC, polyolefin, or poly-ethylene backing with an adhesive to hold the dies in place. Majorly there are two types of dicing tapes in the market, UV film sensitive tapes and silicone free adhesive plastic films. Silicone free adhesive films results in cleaner process and more consistent adhesive properties as the tape contains no silicone release agents. These films are made of PVC with a rubber base adhesive. As the global electronics and semiconductors market is growing the market of UV dicing tapes which are categorized in pressure sensitive adhesive tapes is expected to grow at a faster rates because of its certain properties such as strong adhesion and superior performance in high heat and pressure conditions. These tapes are used in wafer dicing, back grinding, PBC grinding and glass dicing applications. 

Dicing tapes market: Dynamics

The global electronics and semiconductor industry is very vast and is expected to grow due to the demand of compact electronics components and semiconductors which reduces the size of electronic device or the appliance making it easy to handle, and transport. The market for polyolefin UV tapes is expected to grow in the coming years due to its high adhesive and high temperature and pressure bearable properties. As the global electronics and semiconductor market is growing it is paving the path for UV dicing tapes. The dicing tapes market is driven by the demand for small electronic components such as IC’s and electronic chips. Two categories of tapes are mostly used, blue and UV tape. Blue tapes are suitable in dicing standard silicon wafers and is sometimes simultaneously used with costly UV tape when it comes to dicing of more delicate materials such as GaAs. Plasma dicing is attracting the interests of the global electronic and semiconductor industry as a practical alternative to conventional methods that use saw blades and lasers. Plasma dicing ensures the increase in wafer throughput, dye per wafer and dye yields due to less damage in processing. Adding to this, another threat to the growing market of Dicing tapes is the dicing of robust packages in high volume. Packages such as BGA, QFN, or CSPs, a tape less, jig based systems which use vacuum system for the wafer through-put. 

Dicing tapes market: segmentation

Dicing tape market is segmented on the basis of material

  • UV dicing tapes
  • Non UV dicing tapes
  • Silicon free adhesive films

Dicing tapes market is segmented on the basis of strength

  • Adhesive strength
  • Tensile strength
  • Elongation

Dicing tapes market is segmented on the basis of thickness

  • Backing film thickness
  • Adhesive thickness

Dicing tapes market is segmented on the basis of thickness

  • Back Grinding
  • Wafer Dicing

Dicing tapes market: Geographical outlook of the dicing tapes market in the respective regions.

The global dicing tapes market is divided in seven regions

  • North America
  • Latin America
  • Western Europe
  • Eastern Europe
  • Asia Pacific excluding Japan (APEJ)
  • Middle East & Africa (MEA)
  • Japan

Asia Pacific is estimated to be the largest market for dicing tapes accounting for over half of the global revenue and over 10% of CAGR followed by second largest North America region.  PO UV tapes segment holds the largest market in North America. The growing demand for semiconductors and minute components such as chips and IC’s has driven the dicing tapes market in Asia pacific region. The UV dicing tapes serve the global semiconductor and electronics market with many benefits one of which is the high resistance to temperature and pressure and the other is that these tapes can be recycled. These factors are expected to play a key role in the growth of the dicing tapes market. However, the market in Europe is quiet mature so the growth of dicing tape market in this region is expected to grow at a slower rate.  

Dicing tapes market: Key players

  • Furukawa Electric Co. Ltd.
  • Nitto Denko Corporation
  • Mitsui Corporation
  • Lintec Corporation
  • Sumitomo Bakelite Co. Ltd.
  • Denka Company Limited
  • Pantech Tape Co. Ltd
  • Ultron Systems, Inc.
  • NEPTCO, Inc.
  • Nippon Pulse Motor Taiwan
  • Loadpoint Limited
  • AI Technology, Inc.
  • Minitron Electronic GmbH.
  • Denka electronics & products

MRR.BIZ has been compiled in-depth market research data in the report after exhaustive primary and secondary research. Our team of able, experienced in-house analysts has collated the information through personal interviews and study of industry databases, journals, and reputable paid sources.

The report provides the following information:

  • Tailwinds and headwinds molding the market’s trajectory
  • Market segments based on products, technology, and applications
  • Prospects of each segment
  • Overall current and possible future size of the market
  • Growth pace of the market
  • Competitive landscape and key players’ strategies

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