Proliferation of Smartphones to Boost Demand for Robust IC packaging, Driving Global System-in-Package Market


Published Date : Nov 21, 2016

ALBANY, NY, Nov 21, 2016: The report forecasts the global system-in-package market to exhibit a positive CAGR of over 10% between 2016 and 2020. The advent of advanced and compact consumer electronic devices has been identified as one of the primary factors aiding the global system-in-package (SiP) market’s expansion. The report presents a round-up of the various growth drivers and restrains influencing the market’s trajectory over the course of the forecast period. Intended to update stakeholders about the prevailing market trends, it also profiles some of the leading companies operating in the global system-in-package market.

The transformation witnessed in the consumer electronics industry over the last decade has created significant opportunities for the growth of the market. As the world witnessed a soaring adoption of the smart homes concept in the last few years, enabling to control and monitor electronic devices remotely with the help of mobile applications, the demand for advanced packaging techniques rose. The advent of smart household technologies are further expected to compel manufacturers upgrade their products in terms of factors such as power consumption and user-interface, which will boost the development of feature-rich compact devices.

Obliged by these developments, semiconductor manufacturers are investing in the development of denser ICs. This will fuel demand for advanced IC packaging techniques such as system-in-package in response. Regionally, the report projects APAC to exhibit the most lucrative opportunities due to the presence of numerous foundries and OSATs across nations such as Taiwan, South Korea, Japan, and China. The presence of various semiconductor manufacturing units in the region, coupled with the increasing demand for semiconductors in the consumer electronics and communication sectors will aid the expansion of the SiP market in the region. The APAC market is also gaining as leading manufacturers such as Sony, Samsung, Toshiba, Panasonic, and LG are domiciled in the region.

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Based on application, the communications segment accounted for the largest share in the global market in 2015. The rising proliferation of smartphones has fuelled the demand for advanced and smaller-sized ICs requiring robust packaging. This is one of the key factors contributing to the segment’s growth over the years.

To study the competition prevailing in the market the report has profiled some of the leading companies operating in the global system-in-package market. Companies such as Jiangsu Changjiang Electronics Technology (JCET), United Test and Assembly Center (UTAC), Amkor Technology, Siliconware Precision Industries (SPIL), and ASE have been identified as the leading vendors. Other prominent companies profiled in the report are ChipSiP Technology, Samsung Electro-Mechanics, NANIUM, ChipMOS Technology, and Octavo Systems.

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