Published Date : Feb 13, 2017
ALBANY, NY, Feb 13, 2017: The study, titled “Global Semiconductor Chip Packaging Market 2017-2021,” offers a detailed reports of the market, focusing on the key factors anticipated to encourage the growth of the overall market in the next few years. In addition, the product segmentation, applications, technological advancements, and the key regional segments of the global semiconductor chip packaging market have been discussed in the research report. According to the research study, the global market for semiconductor chip packaging is predicted to register an impressive 31.0% CAGR between 2017 and 2021.
A substantial rise in the miniaturization of electronics devices and the increasing adoption of semiconductor ICs in the automotive industry are some of the key factors anticipated to encourage the growth of the overall market in the coming years. In addition, the rising number of fables semiconductor companies is likely to supplement the development of the market in the coming years. However, the requirement of initial investment and the robust changes in technology are predicted to restrict the growth of the global semiconductor chip packaging market in the near future. Nonetheless, the advent of 3D chip packaging is estimated to offer promising opportunities in the coming years.
In 2015, the 3D IC TSV stacks segment led the global market and is expected to remain in the leading position throughout the forecast period. The rising popularity of 3D TSV technology for RF filters, heterogeneous interconnection with CIS, MEMS, high-end memory applications, and performance applications is one of the important reasons accelerating the growth of this segment.
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Among the key regional segments, the Asia Pacific market for semiconductor chip packaging is expected to witness significant growth throughout the forecast period. As per the research study, this segment is projected to register a significant share of the overall market in the next few years. The high growth of this region can be attributed to the substantial contribution from South Korea, Taiwan, and Japan. In addition, the presence a large number of leading players is estimated to contribute widely towards the development of the Asia Pacific semiconductor chip packaging market in the next few years. The increasing investments by manufacturers in order to establish new units is anticipated to accelerate the growth of the market.
The global market for semiconductor chip packaging is characterized by a high level of competition, thanks to the presence of a large number of players operating in it. Key players operating in the market are making notable efforts to expand their business horizon and attain a leading position in the global market. Additionally, the increasing number of mergers and acquisitions is projected to accelerate the growth of the overall market throughout the forecast period. Some of the key players mentioned in the research report are ASM Pacific Technology, Applied Materials, TEL, Kulicke & Soffa Industries, and Tokyo Seimitsu.
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