Published Date : Feb 08, 2016
ALBANY, New York, Feb 08, 2016: MarketResearchReports.biz has made an announcement regarding the addition of a new market research report to its huge database of research studies. The research report, titled “Global Semiconductor Packaging and Assembly Equipment Market 2016-2020,” presents detailed reports of the market, including market drivers and restraints, product segmentation, geographical segmentation, challenges and opportunities, vendor reports, and current market trends. The research report has also added valued inputs and recommendations from professionals and industry experts to guide existing as well as new players in designing their business policies efficiently.
According to the research study, the global market for semiconductor packaging and assembly equipment is estimated to register a 4.68% CAGR between 2016 and 2020. The research report has further included infographics, tables, and charts to present the forecast figures as well as the historical data regarding the market.
The growing demand for semiconductor ICs, growing miniaturization of electronic devices, rising application of semiconductor ICs in the IoT, and increasing complexity of semiconductor IC designs are some of the major factors that are expected to fuel the growth of the global semiconductor and assembly equipment market in the next few years. In addition, the rising number of mergers and acquisitions taking place in the market, increasing adoption of semiconductor ICs in automobiles, and rising technological developments in the semiconductor industry are the current market trends that are boosting the demand for semiconductor and assembly equipment globally throughout the forecast period.
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On the flip side, for the global market, the fluctuating rates of foreign exchange are considered as one of the biggest challenges for the growth of the global semiconductor and assembly equipment market. In addition, the cyclical nature of the semiconductor industry and the requirement of heavy investments are expected to hamper the growth of the global semiconductor and assembly equipment market in the coming years.
On the basis of type, the global market for semiconductor and assembly equipment has been divided into water-level packaging and assembly equipment and die-level packaging and assembly equipment. The research report has further included the market share of and revenue generated from the two types of packaging and assembly equipment. Based on geography, the global market for semiconductor and assembly equipment has been categorized into Asia Pacific, Europe, and North America.
In the last section, the global market report for semiconductor and assembly equipment covers the vendor reports of the market including the company profile, inception details, product portfolio, financial overview, business strategies, SWOT reports, and recent developments from the companies. The key vendors operating in the global market for semiconductor and assembly equipment include Kulicke and Soffa Industries, Tokyo Seimitsu, TEL, EVG, DISCO, Applied Materials, and ASMPT. Some of the other vendors mentioned in the research report are Ulvac Technologies, Suss Microtec, Ultratech, Rudolph Technologies, and SEMES.
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