Published Date : Aug 21, 2018
ALBANY, New York, August 21, 2018 - The global semiconductor equipment market is envisaged to increase growth with important application in the manufacture of integrated devices. A report added by MarketResearchReports.biz gives explanation on critical dynamics of the market and how they could influence growth in the near future. It bears the title “Global Semiconductor Equipment Market Professional Survey Report 2018.” Rise in the number of foundries, increasing growth of the consumer electronics industry, swelling demand for hybrid and electric vehicles, and development of research and development facilities could further push the growth of the market. Yet, there could be more factors augmenting the demand in the market.
The global semiconductor equipment market is foretold to rise at a 6.9% CAGR between 2018 and 2025 to reach to a US$80.7 bn valuation by the final forecast year. In 2017, it was worth a US$47.4 bn.
Depending on its process and functions, the cost of semiconductor equipment could increase in the coming years. High capital requirement and increasing research and development cost are expected to make it difficult for new players to enter the global semiconductor equipment market. Nonetheless, new players could cash in on the opportunities offered by untapped markets to increase their growth in the next few years. On the basis of application, the market is segregated into sensors, optoelectronic device, discrete device, and integrated circuit. By product, the market is divided into semiconductor back-end and front-end equipment.
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Under the category of semiconductor back-end equipment, players could offer products such as metrology, bonding, dicing, and assembly and packaging. By semiconductor front-end equipment, the global market may be bifurcated into cleaning processes, wafer surface conditioning, and lithography. Amongst various semiconductor back-end equipment products, bonding equipment is foreseen to show higher growth during the course of the forecast period. Today, semiconductor manufacturers demand wafer bonding equipment at a high rate. This is to ensure product efficiency and dependability. Wafer bonding is considered to be a technology that is consistently used in the semiconductor manufacturing industry.
The U.S. attains a leading position among other semiconductor manufacturing equipment providers. Almost 84% of the sales of semiconductor manufacturing equipment produced in the country is achieved in different parts of the world. This could indicate that companies operating in the country may need to concentrate on exports to secure a position of strength in the market. On the other hand, China is forecast to show quicker and larger growth in the market in the foreseeable future as it has been showing since the last decade or so.
The global semiconductor equipment market includes top players such as Tokyo Electron, ASML, and Applied Materials. Amongst these, Applied Materials is envisioned to become prominent in the market owing to its strong hold over the business.
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